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www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 1 / 19 02.mar.2012 rev.001 tsz22111 ? 14 ? 0 01 4.5v to 13.2v, 2a 1ch synchronous buck converter integrated fet b d9141muv rohms high efficiency step - down switching regulator bd9141muv is a power supply designed to produce a low voltage including 5.0/3.3 volts from 2 lithium cell power supply line. offers high efficiency with our original pulse skip control technology and synchronous rectifier. employs a current mode control system to provide faster transient response to sudden change in load. offers fast transient re sponse with current mode pwm control system. offers highly efficiency for all load range with synchronous rectifier (nch/pch fet) and sllm (simple light load mode) incorporates soft - start function. incorporates thermal protection and ulvo functions. incorp orates short - current protection circuit with time delay function. incorporates shutdown function ? i nput voltage range: 4 .5v to 13.2 v ? o utput voltage range: 2.5 v to 6.0 v ? o utput current: 2.0 a(max.) ? switching frequency: 500k hz(typ.) ? pch fet on resistance: 150m (typ.) ? nch fet on resistance: 80m (typ.) ? s tandby current: 0 a (typ.) ? operatin g temperature range : - 40 to +105 vqfn020v4040: 4.00mm x 4.00mm x 1.00mm applications p ower supply for lsi including dsp, micro computer and asic typical application circuit fig.1 typical application circuit product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays. vqfn020v4040 datasheet
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 2 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet pin configuration (top view) fig.2 pin configuration pin description pin no. pin name pin function 1,2,3,4,5 sw pch/nch fet drain output pin 6,7,8 pv cc pch fet source pin 9 n. c. non connection 10 vcc vcc power supply input pin 11 gnd ground 12 adj output voltage detect pin 13 ith gmamp output pin/connected phase compensation capacitor 14 vreg reference voltage 15,16 n.c. non connection 17 en enable pin(active high) 18,1 9,20 pgnd nch fet source pin block diagram f ig. 3 block diagram sw n.c. n.c. pgnd en pvcc vcc gnd adj ith vreg n. c. 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 3 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet absolute maximum ratings parameter symbol limits unit v cc voltage v cc - 0.3 to +15 *1 v pv cc voltage pv cc - 0.3 to +15 *1 v en voltage v en - 0.3 to +15 v sw voltage v sw - 0.3 to +15 v ith,vreg,adj voltage v ith ,v reg, v adj, - 0.3 to +7 v power dissipation 1 pd1 0.34 *2 w power dissipation 2 pd2 0.70 *3 w p ower dissipation 3 pd3 2.21 *4 w p ower dissipation 4 pd4 3.56 *5 w operating temperature range topr - 40 to +105 storage temperat ure range tstg - 55 to +150 maximum junction temperature tjmax +150 *1 pd should not be exceeded . *2 ic only. *3 1 layer, mounted on a board 74.2mm 74.2mm 1.6mm glass - epoxy pcb (copper foil area : 10.29mm2) *4 4 layers, mounted on a board 74.2 mm 74.2mm 1.6mm glass - epoxy pcb (1st ,4th copper foil area : 10.29mm2 2nd ,3rd copper foil area : 5505mm2) ,. *5 4 layers, mounted on a board 74.2mm 74.2mm 1.6mm glass - epoxy pcb (copper foil area : 5505mm2) , copper foil in each layers. (ta= - 40 to +105 ) parameter symbol limits unit min. typ. max. v cc voltage v cc *6 4.5 *7 8.0 13.2 v pv cc voltage p vcc *6 4.5 *7 8.0 13.2 v en voltage v en 0 - vcc v sw average output current isw *6 - - 2.0 a output voltage settin g range v out *7 2.5 - 6.0 v *6 pd should not be exceeded . *7 vccmin. = vout + 1.3v. (ta=25 , v cc =pv cc =8.0v, en=v cc , r 1 =8.2k , r 2 =43k , unless otherwise specified. ) parameter symbol limits unit conditions min. typ. max . standby current i stb - 0 10 a en=gnd bias current i cc - 300 500 a en low voltage v enl - gnd 0.8 v standby mode en high voltage v enh 2.0 v cc - v active mode en input current i en - 1.6 10 a v en =8v oscillation frequency f osc 400 500 600 khz pc h fet on resistance r onp - 150 300 m vcc =8v nch fet on resistance r onn - 80 160 m vcc =8v adj voltage v adj 0.788 0.800 0.812 v ith si nk current i thsi 10 20 - a v adj =1.0v ith s ource c urrent i thso 10 20 - a v adj =0.6v uvlo threshold voltage v uvlo1 3.90 4.10 4.30 v v cc =8v uvlo2 3.95 4.20 4.50 v v cc =0v ss 0.5 1 2 ms timer latch time t latch 1 2 3 ms scp/tsd operated output short circuit threshold voltage v scp - 0.4 0.56 v v adj =0.8v
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 4 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet typical performance curves fig.4 vcc - vout fig.6 iout - vout fig.5 ven - vout fig.7 ta - vout
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 5 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet fig.9 ta - fosc fig.8 efficiency fig.1 1 ta - ven fig. 10 ta - ronn, ronp
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 6 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet fig. 12 ta - icc fig.13 vcc - fosc fig.15 sw waveform io=10ma fig.14 soft start waveform
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 7 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet fig.16 sw waveform io=2000ma fig.17 tran sient response io=0.5a
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 8 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet application information operation bd9141muv is a synchronous rectifying step - down switching regulator that achieves faster transient response by employing current mode pwm c ontrol system. it utilizes switching operation in pwm (pulse width modulation) mode for heavier load, whi le it utilizes sllm (simple light load mode) operation for lighter load to improve efficiency. synchronous rectifier it does not require the power to be dissipated by a rectifier externally connected to a conventional dc/dc converter ic, and its p . n jun ction shoot - through protection circuit limits the shoot - through current during operation, by which the power dissipation of the set is reduced. current mode pwm control synthesizes a pwm control signal with a inductor current feedback loop added to the v oltage feedback. ? pwm (pulse width modulation) control the oscillation frequency for pwm is 500k hz. set signal form osc turns on a p - channel mos fet (while a n - channel mos fet is turned off), and a n inductor current i l increases. the current comparator ( current comp) receives two signals, a current feedback control signal (sense: voltage converted from i l ) and a voltage feedback control signal (fb), and issues a reset signal if both input signals are identical to each other, and turns off the p - channel mo s fet (while a n - channel mos fet is turned on) for the rest of the fixed period. the pwm control repeat this operation. ? sllm (simple light load mode) control when the control mode is shifted from pwm for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn off with the device held operated in normal pwm control loop, which allows linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. although the pwm control loop continues to operate with a set signal from osc and a reset signal from curren t comp, it is so designed that the reset signal is held issued if shifted to the light load mode, with which the switching is tuned off and the switching pulses are thinned out under control. activating the switching intermittently reduces the switching d issipation and improves the efficiency. fig.19 diagram of current mode pwm control osc level shift driver logic r q s i l sw ith current comp gm amp. set reset fb load sense v out v out fig.20 pwm switching timing chart fig. 2 1 s llm tm switching timing chart current comp set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb current comp set reset sw v out pvcc gnd gnd gnd 0a v out (ave) sense fb i l not switching i l
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 9 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet description of operations ? soft - start function en terminal shifted to high activates a soft - starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ? shutdown function with en terminal shifted to low, the device turns to standby mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to off. circuit current during standby is 0 a (typ.). ? uvlo function detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 100 mv (typ.) is provided to prevent output chattering. fig.22 soft start, s hutdown, uvlo timing chart ? short - current protection circuit with time delay function turns off the output to protect the ic from breakdown when the incorporated current limiter is activated continuously for the fixed time(t latch ) or more . the output th us held tuned off may be recovered by restarting en or by re - unlocking uvlo. fig.23 short - current protection circuit with time delay timing chart hysteresis 100m v tss tss tss soft start standby mode operating mode standby mode operating mode standby mode operating mode standby mode uvlo en uvlo uvlo v cc en v out t2=t latch output off latch en v out output short circuit threshold voltage i l standby mode operating mode operating mode en timer latch en standby mode i l limit t1 www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 10 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet information on adva ntages advantage 1 offers fast transient response with current mode control system. voltage drop due to sudden change in load was reduced by about 5 0%. fig. 2 4 comparison of transient response advantage 2 offers high effic iency for all load range. ? for lighter load : utilizes the current mode control mode called sllm for lighter load, which reduces various dissipation such as switching dissipation (p sw ), gate charge/discharge dissipation, esr dissipation of output capacitor (p esr ) and on - resistance dissipation (p ron ) that may otherwise cause degradation in efficiency for lighter load. achieves efficiency improvement for lighter load. ? for heavier load : utilizes the synchronous rectifying mode and the low on - resistance mo s fets incorporated as power transistor. o n resistance of p - channel mos fet : 150m (typ.) on resistance of n - channel mos fet : 80m (typ.) achieves efficiency improvement for heavier load. offers high efficiency for all load range with the i mprovements mentioned above. advantage 3 ? supplied in smaller package due to small - sized p ower mos fet incorporated. reduces a mounting area required. fig.26 example application fig. 2 5 efficiency conventional product ( load response i o =0.5a o =0.5a ? ? 0.001 0.01 0.1 1 0 50 100 pwm sllm improvement by sllm system improvement by synchronous rectifier efficiency [%] output current io[a] v out i out v out i out 50mv 110mv dc/dc convertor controller r ith l co v out c ith v cc cin 10mm 15mm r ith c ith c in c o l
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 11 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet switching regulator efficiency efficiency ? may be expresse d by the equation shown below: efficiency may be improved by reducing the switching regulator power dissipation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet pd(i 2 r) 2) gate charge/discharge dissipation pd(gate) 3) switching dissipation pd(sw) 4) esr dissipation of capacitor pd(esr) 5) operating current dissipation of ic pd(ic) 1) pd(i 2 r)=i out 2 (r coil +r on ) (r coil [ ] d c resistance of inductor , r on [ ] on resistance of fet , i out [a] output curren t. ) 2)pd(gate)=cgs f v 2 (cgs[f] gate capacitance of fet , f[h] switching frequency , v[v] gate driving voltage of fet ) 4)pd(esr)=i rms 2 esr (i rms [a] ripple current of capacitor , esr[ ] equivalent series resistance. ) 5)pd(ic)=vin i cc (i cc [a] circuit current. ) as this ic functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losse s due to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation . if v cc =8v, v out =5v , r onp =0.15 , r onn =0.08 i out =2a, for example, d=v out /v cc =5/8=0.625 r on =0.625 0.15+(1 - 0.625) 0.08 =0.09375+0.03 =0.12375[ ] p=2 2 0.12375 0.495[w] as r onp is greater than r onn in this ic, the dissipation increases as the on duty becomes greater. with the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. out out vin out pin out p out +p d 2 rss out drive 3)pd(sw)= (c rss [f] drive [a] out 2 on r on =d onp +(1 - d)r onn d out /v cc ) r coil onp onn out power dissipation:pd [w] ambient temperature:ta [ ] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 2.21w 3.56w 1.0 0.70w 0.34w 4 layers (copper foil area : 5505mm 2 ) copper foil in each layers. j - a=35.1 /w 4 layers (copper fo il area : 10.29m 2 ) copper foil in each layers. j - a=56.6 /w 4 layers (copper foil area : 10.29m 2 ) j - a=178.6 /w ic only. j - a=367.6 /w 105
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 12 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet selection of components externally con nected 1. selection of inductor (l) current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. t he inductor must be selected allowing sufficient margin w ith which the peak current may not exceed its current rating. if v cc =8v, v out =5v, f=500khz, i l =0.3 2a=0.6a , for example, (bd9141muv) select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor f or better efficiency. 2. selection of output capacitor (c o ) the inductance significantly depends on output ripple current. as seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. l = (v cc - v out ) out l cc ??? l =0.2 out max. [a] ??? cc - v out ) out l cc ??? l : output ripple current, and f: switching fr equency ) output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. output ripple voltage is determined by the equation (4) out = l ??? l : output ripple current , esr: equivalent series resistance of output capacitor ) *rating of the capacitor should be determined allowing sufficient margin against output voltage. a 22 f to 100 f ceramic capacitor is recommended. less esr allows reduction in output ripple voltage. fig.29 output capacitor (8 - 5) i l v cc il l co v out fig.28 output ripple current i l v cc l co v out esr
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 13 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet 3. selection of input capacitor (cin) a low esr 22 f/25v ceramic capacitor is recommended to reduce esr dissipation of input capacitor for better efficiency. 4. determination of r ith , c ith that works as a phase compensator as the current mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of a output capaci tor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. input capacitor to select must be a low esr capacitor of the capacitance sufficient to cope with high ripple current to prevent high transien t voltage. the ripple current i rms is given by the equation ( 5 ): i rms =i out out (v cc - v out ) v cc [a] ??? out , i rms = i out 2 < worst case > i rms(max.) i rms =2 rms ] gain [db] phase [deg] fig.31 open loop gain characteristics a 0 0 - 90 a 0 0 - 90 fz(amp.) fig.32 error amp phase compensation characteristics fp= 2 o o 1 fz (esr) = 2 sr o 1 pole at power amplifier when the output current decreases, the load resistance r o increases and the pole frequency lowers. fp (min.) = 2 omax. o 1 [hz] (max.) = 2 omin. o 1 [hz] (amp.) = 2 ith ith 1 fig.30 input capacitor fp(min.) fp(max.) fz(esr) i out min. i out max. gain [db] phase [deg] v cc l co v out cin increasing c apacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr reduces to half.) if v cc =8v, v out =5v, and i outmax.= 2a, (bd9140muv)
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 14 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet stable feedback loop may be achieved by cancelin g the pole fp (min.) produced by the output capacitor and the load resistance with cr zero correction by the error amplifier. 5. determination of output voltage the output voltage v out is determined by the equation ( 6 ): v out =(r2 /r1+1) v adj ??? (6) v adj : voltage at adj terminal (0.8v typ.) with r1 and r2 adjusted, the output voltage may be determined as required. adjustable output voltage range : 2.5v to 6.0v fig.34 determination of output voltage use 1 k? to 100 k? resistor for r1. if you can use the resistance more than 100k or they have a big range between the setting value of output voltage and input voltage. 6.selection of the reference voltage capacitor (c vreg ) vreg voltage is the reference voltage created by input voltage (vcc voltage ). c vreg capacitor should be selected 0.1f or more. gnd,pgnd sw v cc ,pv cc en v out ith v cc v out cin r ith c ith l esr c o r o v out fig.33 typical application fz (amp.) = fp (min.) 2 ith ith 1 = 2 omax. o 1 sw a dj l co r2 r1 output the minimum input voltage depends on the setting output voltage. basically, it is recommended to use in the condition : v ccmin = v out +1.3v. it is shown the necessary output current value at the minimum input voltage. (dcr of inductor : 0. 1 vo=3.3v vo=4.0v vo=5.0v vo=6.0v 4.5 5 5.5 6 6.5 7 7.5 8 0 0.5 1 1.5 2 output current : iout[a] input voltage : vcc[v]
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 15 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet cautions on pc board layout fig.36 layout diagram for the secti ons drawn with heavy line, use thick conductor pattern as short as possible. lay out the input ceramic capacitor c in closer to the pins pv cc and pgnd, and the output capacitor c o closer to the pin pgnd. lay out c ith and r ith between the pins ith and gnd as neat as possible with least necessary wiring. the non connection pin must be left open or connected to gnd. vqfn020v4040 (bd9141muv) has thermal fin on the reverse of the package. the package thermal performance may be enhanced by bonding the fin to gnd plane which take a large area of pcb. recommended components lists on above application symbol part value manufacturer series l coil 4.7h tdk rlf7030t - 4r7m3r4 c in ceramic capacitor 22f kyocera cm 32x5r226m25a c o ceramic capacitor 22f kyocera cm 32x5r226m10a c vreg ceramic capacitor 0.1f murata grm1 88b31h104ka92 c ith ceramic capacitor vo=3.3v 1000pf murat a grm1 882c1h102ja01 vo=5v 1000pf murata grm1 882c1h102ja01 r ith resistance vo=3.3v 20k rohm mcr03 series vo=5v 47k rohm mcr03 series the parts list presented above is an example of recommended parts. although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteristics should be considered in establishing these margins . when switching noise is substantial and may impact the system, a low pass filter should be inserted between the vcc and pvcc pins, and a schottky barrier diode established between the sw and pgnd pins. adj v cc ith gnd en pv cc sw pgnd v cc r ith gnd c o c in v o ut en l c ith 2 r 1 vreg c vreg
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 16 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet i/o equivalence circuit fig.37 i/o equivalence circuit en ? en pin ? sw pin pv cc sw pv cc pv cc ith ? ith pin v cc ? adj pin adj ? vreg pin vreg v cc v cc
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 17 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet operational notes 1. absolute m aximum ratings while utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. if broken, short - m ode or open - mode may not be identified. so if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowest electrical potential in any operating conditions . 3. short - circuiting between terminals, and mismounting when mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. failure to do so may result in ic breakdown. short - circuiting due to foreign matters entered between output terminals, or between output and power supply or gnd may also cause breakdown. 4. operation in strong electromagnetic field be noted that using the ic in the strong electromagnetic radiation can cause operation failures. 5. thermal shutdown protection circuit thermal shutdown protection circuit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic . so, the ic the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 6. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impedanc e during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storag e. when connecting to jigs in the inspection process, be sure to turn off the power supply before it is connected and removed. 7. input to ic terminals this is a monolithic ic with p + isolation between p - substrate and each element as illustrated below. this p - layer and the n - layer of each element form a p - n junction, and various parasitic element are formed. if a resistor is joined to a transistor terminal as shown in fig 3 8. p - n junction works as a parasitic diode if the following relationship is sat isfied; gnd>terminal a (at resistor side), or gnd>terminal b (at transistor side); and if gnd>terminal b (at npn transistor side), a parasitic npn transistor is activated by n - layer of other element adjacent to the above - mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. it is therefore requested to take care not to use the device in such manner that the vol tage lower than gnd (at p - substrate) may be applied to the input terminal, which may result in activation of parasitic elements. fig .3 8 simplified structure of monorisic ic 8. ground wiring pattern if small - signal gnd and large - current gnd are pro vided , it will be recommended to separate the large - current gnd pattern from the small - signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large c urrent will cause no fluctuations in voltages of the small - signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. 9. selection of inductor it is recommended to use an inductor with a series resistance elem ent (dcr) 0.1 or less. when using an inductor over 0.1 , be careful to ensure adequate margins for variation between external devices and this ic, including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within operation range status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a referen ce to help reading the formal version . if there are any differences in translation version of this document formal version takes priority. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic e lement pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 18 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet ordering information b d 9 1 4 1 m u v e 2 part number package muv: vqfn0 20 v 4040 packaging and forming spec ification e2: embossed tape and reel physical dimension tape and reel information marking diagram vqfn020v4040 (top view) d 9 1 4 1 part number marking lot number 1pin mark
www.rohm.com tsz02201 - 0j3j0aj00180 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 19 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9141muv data s heet revision history date revision changes 17.jan.2012 001 new release
datasheet d a t a s h e e t notice - rev.001 notice precaution for circuit design 1) the products are designed and produced for applicatio n in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremel y high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel contro llers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the rohm sales staff in advance. if product malfunctions may re sult in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard environment and not in any spec ial environments. a pplication of the products in a special environment can deteriorate product per formance. accordingly, verification and confirmation of product performance, prior to use, is recomm ended if used under the following conditions: [a] use in various types of liquid, includin g water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing componen ts, plastic cords, or other flammable items [f] use involving sealing or coating the prod ucts with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) verification and confirmation of performance characte ristics of products, after on- board mounting, is advised. 5) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 6) de-rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 7) confirm that operation temper ature is within the specified range described in product specification. 8) failure induced under deviant condition from what def ined in the product specific ation cannot be guaranteed. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the remainder of fl ux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance. regarding precaution for mounting / circu it board design, please specially refe r to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their const ants, and other types of information cont ained herein are applicable only when the products are used in accordance with standard methods . therefore, if mass production is intended, sufficient consideration to external conditions must be made.
datasheet d a t a s h e e t notice - rev.001 precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution during manufacturing and st oring so that voltage exceeding product ma ximum rating won't be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / so lder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriorate if the products are stored in the following places: [a] where the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] where the temperature or humidity exceeds those recommended by the company [c] storage in direct sunshine or condensation [d] storage in high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding recommended storage time period . 3) store / transport cartons in the correct direction, whic h is indicated on a carton as a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a dry bag. precaution for product label qr code printed on rohm product label is only for internal us e, and please do not use at cust omer site. it might contain a internal part number that is inconsistent with an product part number. precaution for disposition when disposing products please dispose them properly with a industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under controlled goods prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. prohibitions regarding industrial property 1) information and data on products, including application exam ples, contained in these specifications are simply for reference; the company does not guarantee any industrial pr operty rights, intellectual property rights, or any other rights of a third party regarding this information or data. ac cordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the us e of the products listed herein. 2) the company prohibits the purchaser of its products to exercise or use the in tellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products.

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